The Effect of Base Metal Cr Content on the Transient Liquid Phase Bonding Process for Superalloys

Abstract

The transient liquid phase (TLP) bonding of a nickel based oxide dispersion strengthened (ODS) alloy was performed using a Ni-P interlayer. The diffusion of Cr from the parent metal into the joint region was investigated and its effect on isothermal solidification of the joint was determined. Metallurgical observations suggested the isothermal solidification process is not only controlled by the loss of P from the liquid interlayer, but the diffusion of Cr into the liquid interlayer helps to accelerate the solidification process.